3D Models of TO-3PN and SC-65 Lead Forming Packages
About this design
Professional 3D CAD models featuring various lead forming options for TO-3PN (TO-3P-3L) and SC-65 (TO-3P-3LD) semiconductor packages, suitable for engineering and design applications.
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The files are shared to help you get inspired and speed up your workflow. They may not be fully accurate or production-ready, so review carefully before use.
| View Name | Extension | Action |
|---|---|---|
| Design file | step | |
| Front View | webp | |
| Top View | webp | |
| Bottom View | webp | |
| Left Side View | webp | |
| Right Side View | webp | |
| Isometric View | webp |
| File Name | Action |
|---|---|
| No supporting files | |
About CAD
The CAD model comprises 103 faces, 257 edges, 164 vertices, 5 solids. Surface types include 72 planar, 22 cylindrical, 4 spherical, 5 toroidal. Orientations: 58 along the X-axis, 27 along the Y-axis, 18 along the Z-axis. Model dimensions: 15.60 mm wide, 39.90 mm high, 4.80 mm deep. Volumetric data: maximum volume of 1023.42 mm³, minimum volume of 15.61 mm³, average volume of 274.39 mm³, total volume of 1371.95 mm³
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